IEEE 1838-2019 pdf download.IEEE Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits Like all micro-electronic products, these die stacks need to be tested before they can be shipped with acceptable quality levels to their customers. We distinguish the following tests: (1) pre-bond tests prior to stacking, (2) mid-bond
Continue readingIEEE 1838-2019 pdf download
